力安科技 Liantec Systems Corporation

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Embedded Computing Solution

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Press Release  >>  Product News  >>  Embedded Platform Solution


Liantec Announce the Tiny-BusTM Modular Expansion Solution :

the Flexible Embedded PCI-EG, AGP, PCI-E, PCI Expansibility

http://www.liantec.com/product/TBM.htm

 


Liantec Systems Corporation announces the Tiny-BusTM modular expansion solution as the standard embedded system integration solution. The Tiny-BusTM is integrated with 16xPCI-Express Graphics, AGP, PCI-Express and PCI bus interfaces on the 2.920 x 3.600 inches of daughterboard. With the Tiny-BusTM modular expansion solution, the system integrators can build their niche platform systems with special interface modules easily, quickly and cost effectively.

Multiple Bus Interface Expansibility 

The Tiny-BusTM modular expansion solution is integrated with the popular bus interface including the 16xPCI-Express Graphics (PCI-EG), AGP, PCI-Express (PCI-E) and PCI in four board-to-board connectors. For the different applications, the system integrators can choose the interface module for their niche computing platform including 16xPCI-EG based NVIDIA MXM mobile graphics module, Intel SDVO 1080i HDTV module, 4xPCI-E SATA RAID module, PCI-E Gigabit Ethernet module, PCI-E ExpressCard module, AGP-based VGA module, Intel DVI, VIA DVP, SiS VB based graphics expansion module, PCI-based PCMCIA, video capture, switch hub, multiple Ethernet and mini-PCI modules, and other 16xPCI-EG, AGP, PCI-E, PCI-based customized modules.

Flexible Modular Expansion Solution for Software Builders and System Integrators 

For the software builders and system integrators, the Tiny-BusTM modular expansion solution can be help them to build the different platform for different application easily, quickly and cost effectively. With the Tiny-BusTM modular expansion solution, the system integrators can build their systems with the same motherboard and different interface modules for different application, or use the same interface module on different motherboard to separate the marketing position with different CPU platform.

 

Reference Application (1)

Different Application Platform Based on Same Motherboard and Different Interface Module.

 

Reference Application (2)

Same Application Platform with Different Interface Controller Based on Same Motherboard and Different Interface Module with Same External Interface.

 

Reference Application (3)

Same Application Platform with Same Interface Module and Different Motherboard for Different Level of Systems on Same Application.

 

Space-saving Integration for Compact and Slim-type Embedded Systems

With the Tiny-BusTM modular expansion solution, the system integration can be done with the embedded interface modules at the same size as the motherboard. This feature of Tiny-BusTM modular expansion solution bring the benefit of space-saving for the system integrators who need the smallest, compact and slim-type system enclosure for the space-limited embedded computing application.

 

Tiny-Bus in Slim / Short 1U System

1U System at 380x44x195mm (WxHxD) with Mini-ITX EmBoard, Tiny-Bus Module, AC/DC Power Supply and one 3.5" HDD.

 

Quick, Reliable and Low Cost Customized ODM Service with Modular Solution 

To meet the demand of customized ODM/OEM service, the Tiny-BusTM modular expansion solution makes it possible to build the customized niche platform based on the existing motherboard and a new customized interface module. With the same motherboard, the technical risk, lead time and NRE cost of customized ODM solution is under control within the customized interface module rather than a total new motherboard.

For the further information about Tiny-BusTM modular expansion solution, please visit the website at http://www.liantec.com/product/TBM.htm.


Available Motherboard and Function Module with Tiny-Bus Expansibility


Motherboard


Model

Description

ITX-6900

Mini-ITX Intel Embedded 915GM Express Platform

with 16xPCI-EG, Intel SDVO, PCI-E, PCI Tiny-Bus Expansibility

ITX-6800

Mini-ITX Intel Embedded Centrino Pentium M Platform

with 4xAGP, Intel DVO, PCI Tiny-Bus Expansibility

ITX-6700

Mini-ITX AMD Embedded Geode NX Platform

with 4/8xAGP, SiS VB, PCI Tiny-Bus Expansibility


Function Module


Model

Description

TBM-1610

Tiny-Bus 16xPCI-EG MXM Mobile Graphics Module

Support MXM Type-I/II Mobile Graphics Module

with Onboard LVDS and External DVI, HDTV Component Interface

TBM-16SDVO

Tiny-Bus Intel SDVO DVI / HDTV and Mini-PCI Module

with DVI, HDTV and Mini-PCI Socket

TBM-15DVO

Tiny-Bus Intel DVO DVI / TV-out and Mini-PCI Module

with DVI, S-Video TV-out and Mini-PCI Socket

TBM-15VB301

Tiny-Bus SiS VB 301 DVI / TV-out and Mini-PCI Module

with DVI, S-Video TV-out and Mini-PCI Socket

TBM-15VB302

Tiny-Bus SiS VB 302 LVDS / TV-out / HDTV and Mini-PCI Module

with Onboard LVDS, External SDTV, HDTV Connector and Mini-PCI Socket

TBM-1410

Tiny-Bus PCI-E ExpressCard and Mini-PCI Module

with PCI-E ExpressCard and Mini-PCI Socket

TBM-1210

Tiny-Bus PCI PCMCIA and Mini-PCI Module

with Dual PCMCIA and Mini-PCI Socket

TBM-1220

Tiny-Bus PCI Video Capture and Mini-PCI Module

with 4 Channel Video Input and Mini-PCI Socket

TBM-1230

Tiny-Bus 4-Port Switch and Mini-PCI Module

with 4-port 10/100Mbps Switch and Mini-PCI Socket

TBM-1240

Tiny-Bus 4 Gigabit Ethernet and Mini-PCI Module

with 4- Gigabit Ethernet and Mini-PCI Socket


For the further information about Tiny-Bus series, please visit the website at

http://www.liantec.com/product/TBM.htm

 


About Liantec

Liantec Systems Corporation is major in the industrial PC-based embedded computing platform and solution. With the professional R&D and QA teams, Liantec designs, manufactures and markets the board-level, system-level and integration industrial embedded computer products and service. Liantec also provides the customized ODM and OEM service for the wide range of industrial embedded computing platform and solution providers.

For further information about Liantec is available at http://www.liantec.com


Contact Information

Liantec Systems Corporation

10F-5, No. 258, Lien-Cheng Road, Chung-Ho City, Taipei Hsien, 235, Taiwan.

TEL: +886-2-82272189

FAX: +886-2-82272193

Website: http://www.liantec.com

E-mail: info@liantec.com

 



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