|

|
the Embedded Modular
Expansion Solution features compact, rugged, flexible modular expansibility with
multiple bus interfaces. |
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Conception and Features
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Form Factor
| Tiny-Bus EmBoard
| Tiny-Bus
Module
||
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Conception and Features |
|
The
Tiny-BusŪ
Modular Expansion Solution is
integrated with x16 PCI Express or AGP graphics, PCI Express and PCI
bus interfaces on the 2.930 x 3.600 inches or 74.5 x 91.5 mm of
daughterboard, and plug in the motherboard with Tiny-Bus interface.
With the
Tiny-BusŪ
Modular Expansion Solution, the system
integrators can build their niche computing system platforms with
the special interface modules, or select the different CPU platform
based on the same interface module to extend the product line
easily, quickly and cost efficiently.
In order to meet the demand of the
industrial PC-based embedded computing application well, the
Tiny-BusŪ
Modular Expansion Solution features the multiple bus
interface expansion, shock and vibration proof connection, flexible
modular solution, space-saving embedded integration and
easy-to-customize solution for the industrial embedded computing
applications.
Multiple Bus Interface Expansibility
The
Tiny-BusŪ
Modular Expansion Solution is
integrated with the popular bus interfaces including the x16 PCI
Express Graphics (PCI-EG), AGP, PCI Express (PCIe) and PCI bus
interfaces with four embedded parallel -type, high density, high
reliability rugged board-to-board connectors. For different
computing application, the systems can choose the special and
customized interface modules on to build the niche and professional
industrial computing platform.
Shock / Vibration Proof with Rugged
Board-to-Board Connection
The
Tiny-BusŪ
Modular Expansion Solution features the
shock and vibration proof with the rugged board-to-board connectors
for the industrial computing applications in shock and vibration
environment like in-vehicle PC.
Flexible Modular Expansion Solution
for Software Builders and System Integrators
For the software builders and system integrators, the
Tiny-BusŪ
Modular Expansion Solution can
help them to build the different platform
for different application easily, quickly and cost
effectively. With the Tiny-BusŪ
Modular Expansion Solution, the system
integrators can guild their systems with the same motherboard and
different interface modules for different application, or use the
same interface module on different motherboard to separate the
marketing position with different CPU platform.
Space-saving Integration for Compact
and Slim-type Embedded Systems
To meet the demand of compact, small size and slim type embedded
system application, the
Tiny-BusŪ
Modular Expansion Solution features the
embedded parallel-type board-to-board expansion connection to make
the integration be done at the same space of the motherboard with
same total dimension and same total height. This feature bring the
benefit of space-saving for the system integrators who need the
compact and slim-type system enclosures with the special and niche
extension function modules for space-limitation computing
applications.
Quick, Reliable and Low Cost
Customized ODM Service with Modular Solution
For the customized ODM/OEM projects, the
Tiny-BusŪ
Modular Expansion Solution makes it
possible to build the customized computing platform based on the
existing motherboard with the new-design customized function
modules.
□□□
For the further information about the
Tiny-BusŪ
Modular Expansion Solution, please
visit the website at
http://www.liantec.com or contact with
info@liantec.com. |
 |
|
Form Factor
Definition |
|
The
Tiny-BusŪ
Modular Expansion Solution defines the
multiple bus interfaces with two to four high-density parallel-type
connectors for the industrial
PC-based embedded computing applications.
Electronic Signal Definition
The
Tiny-BusŪ
Modular Expansion Solution is
integrated with the popular bus interfaces including the x16 PCI
Express Graphics (PCI-EG) or AGP, PCI Express (PCIe) and PCI bus
interfaces in the four high density, rugged board-to-board
connectors. Based on the latest and popular PC platform, there are
two type of expansion solutions exist as (1) Express Type
with x16 PCI Express Graphics, x4/x1 PCI Express and PCI bus
interfaces, and (2) AGP/PCI Type with AGP and PCI bus
interfaces.
|
Table 2-1.
Tiny-Bus Electronic Signal Definition (All)
|
Tiny-Bus |
Bus Interface |
Description and
Expansibility |
|
TB#A1 |
x16 PCI Express
Part-II (#8~15) |
x16 PCI Express based
graphics module (with TB#A2) |
|
AGP |
1. AGP-based graphics
module.
2. Intel DVO, VIA DVP,
SiS VB video extension module. |
|
TB#A2 |
x16 PCI Express
Part-I (#0~7) |
1. x16 PCI Express based
graphics module (with TB#A1)
2. Intel SDVO video
extension module. |
|
TB#B |
PCI |
Dual bus master 32-bit /
33MHz PCI |
|
TB#C |
PCI Express |
4 lane PCI Express with
one x4 or four x1 PCI Express |
* All of Tiny-Bus interfaces are
based on 80-pin / pitch 0.60mm board-to-board connectors.
* TB#A1 will be x16 PCI Express
OR AGP depends on the graphics interface
offered by main chipset. |
|
Table 2-2.
Tiny-Bus Express Type Signal Definition
|
Tiny-Bus |
Bus Interface |
Description and
Expansibility |
|
TB#A1 |
x16 PCI Express
Part-II (#8~15) |
x16 PCI Express based
graphics module (with TB#A2) |
|
TB#A2 |
x16 PCI Express
Part-I (#0~7) |
1. x16 PCI Express based
graphics module (with TB#A1)
2. Intel SDVO video
extension module. |
|
TB#B |
PCI |
Dual bus master 32-bit /
33MHz PCI |
|
TB#C |
PCI Express |
4 lane PCI Express with
one x4 or four x1 PCI Express |
|
|
Table 2-3.
Tiny-Bus AGP/PCI Type Signal Definition
|
Tiny-Bus |
Bus Interface |
Description and
Expansibility |
|
TB#A1 |
|
AGP |
1. AGP-based graphics
module.
2. Intel DVO, VIA DVP,
SiS VB video extension module. |
|
TB#B |
PCI |
Dual bus master 32-bit /
33MHz PCI |
|
Mechanical Definition
The mechanical definition of the
Tiny-BusŪ
Modular Expansion Solution includes the Standard
Type with standard expansion solution and Extension
Type with extension expansibility for dual DVI/VGA or
DVI/HDTV external connectors based on Express Type and AGP/PCI Type
of computing platform.
|
Figure 2-1.
Tiny-Bus Mechanical Definition (AGP/PCI Standard Type)
* Tiny-Bus AGP/PCI Standard type
includes the AGP (TB#A1) and PCI (TB#B)
connectors. |
|
Figure 2-2.
Tiny-Bus Mechanical Definition (Express Standard Type)
* Tiny-Bus Express Standard
type includes the PCI-EG (TB#A1/2), PCIe (TB#C) and PCI
(TB#B) connectors. |
|
Figure 2-3.
Tiny-Bus Mechanical Definition (Express Extension Type)
* Tiny-Bus Express Extension
type offers 93.50 mm of width to fit (1) DVI and Y/Pb/Pr
HDTV; (2) dual DVI or CRT. |
|
 |
|
Tiny-Bus EmBoard
(Embedded Motherboard) |
|
The Tiny-Bus EmBoard means the embedded motherboard with the
Tiny-BusŪ
Modular Expansion Solution.
The available Tiny-Bus EmBoard includes the form factors of
Mini-ITX by 170 x 170mm or 6.7 x 6.7 inches of dimension;
the 5.25" dive-size EBX single board computing with 203 x
146mm or 8 x 5.75 inches of dimension; the 3.5" drive-size
single board with 146 x 101 mm or 5.75 x 4 inches of
dimension. In spite of the form factor, the available
Tiny-Bus EmBoard also features the different CPU platforms
including Intel embedded mobile Core 2 Duo, Core Duo,
Pentium M, Celeron M, VIA C7, Eden and AMD Geode NX
platforms for high performance, low power and embedded
computing applications. |

Mini-ITX Express
EmBoard with
Tiny-BusŪ
Modular Expansion Solution |
Mini-ITX EmBoard by 170 x 170 mm
The Mini-ITX EmBoard is based on the Mini-ITX form factor at 170 x
170 mm or 6.7 x 6.7 inches, and features the
Tiny-BusŪ
Modular Expansion Solution including the x16 PCI Express
Graphics (PCI-EG), AGP, PCI Express (PCIe) and PCI bus interfaces in
the four high density, rugged board-to-board connectors. <detail>
|
Table 3-1.
Mini-ITX EmBoard with Tiny-Bus Solution
|
Model |
CPU Platform |
Tiny-Bus Modular
Expansion Solution |
|
ITX-6965 |
Intel Mobile Core 2 Duo
CPU
with Intel GME965
Express |
x16 PCI Express (with
Intel SDVO)
x4 / x1 PCI Express, PCI
(dual bus master) |
|
ITX-6945 |
Intel Mobile Core 2 Duo
CPU
with Intel 945GME
Express |
x16 PCI Express (with
Intel SDVO)
x4 / x1 PCI Express, PCI
(dual bus master) |
|
ITX-6910 |
Intel Pentium M /
Celeron M
with Intel 915GME
Express |
x4 / x1 PCI Express
PCI (dual bus master) |
|
ITX-6900 |
Intel Pentium M /
Celeron M
with Intel 915GME
Express |
x16 PCI Express (with
Intel SDVO)
x4 / x1 PCI Express, PCI
(dual bus master) |
|
ITX-6815 |
Intel Pentium M /
Celeron M
with Intel 852GM /
855GME |
AGP (with Intel DVO)
PCI (dual bus master) |
|
ITX-6810 |
Intel Pentium M /
Celeron M
with Intel 852GM /
855GME |
AGP (with Intel DVO)
PCI (dual bus master) |
|
ITX-6700 |
AMD Geode NX CPU
with SiS741CX Platform |
AGP (with SiS Video
Bridge)
PCI (dual bus master) |
|
5.25" Drive Size (EBX) EmBoard by 203
x 146 mm
The
Tiny-BusŪ
Modular Expansion Solution is
integrated with the popular bus interfaces including the x16 PCI
Express Graphics (PCI-EG), AGP, PCI Express (PCIe) and PCI bus
interfaces in the four high density, rugged board-to-board
connectors. <detail>
|
Table 3-2.
5.25" Drive-size EmBoard with Tiny-Bus Solution
|
Model |
CPU Platform |
Tiny-Bus Modular
Expansion Solution |
|
EMB-5740 |
VIA C7-Eden / CX700
Platform |
PCI (dual bus master) |
|
3.5" Drive Size EmBoard by 146 x 101
mm
The
Tiny-BusŪ
Modular Expansion Solution is
integrated with the popular bus interfaces including the x16 PCI
Express Graphics (PCI-EG), AGP, PCI Express (PCIe) and PCI bus
interfaces in the four high density, rugged board-to-board
connectors. <detail>
|
Table 3-3.
3.5" Drive-size EmBoard with Tiny-Bus Solution
|
Model |
CPU Platform |
Tiny-Bus Modular
Expansion Solution |
|
EMB-3700 |
VIA C7-Eden / CX700M
Platform |
AGP (VIA DVP) and PCI
(dual bus master) |
|
|
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|
Tiny-Bus
Modules |
|
The
Tiny-BusŪ
Modular Expansion Solution is
based on the embedded Tiny-BusŪ form factor, offers the
expansibility of multiple bus interfaces including the x16
PCI Express or AGP graphics, PCI Express and PCI bus
interfaces. Liantec provides the Tiny-BusŪ modules as (1) Tiny-BusŪ
graphics and video modules includes x16 PCI Express, Intel
SDVO and DVO, VIA DVP and SiS Video Bridge; (2) Tiny-BusŪ
PCI Express modules include x4 and x1 PCI Express; (3) Tiny-BusŪ
PCI Express modules; and (4) embedded peripheral modules
include the DC/ATX power converter modules. |

Tiny-BusŪ
Graphics Extension Module |
Graphics / Video Extension Solution
The Tiny-BusŪ graphics / video extension solution is integrated
with the x16 PCI Express and AGP graphics bus interfaces, offers the
embedded graphics / video expansibility including x16 PCI Express /
AGP based independent GPU module, and Intel SDVO, DVO, VIA DVP, SiS
VB (Video Bridge) based video expansion solution with onboard GMCH /
IGP chipset built-in graphics core. <detail>
|
Table
4-1.
Tiny-Bus
Graphics / Video Extension Module |
|
Tiny-Bus
Module |
Bus Interface |
Application |
Features |
|
TBM-16AM56 |
x16 PCI Express |
Graphics |
ATi M56 GPU |
|
TBM-1610 |
x16 PCI Express |
Graphics |
NVIDIA MXM
Type-I/II |
|
TBM-16SDVOA |
Intel SDVO* |
Video Extension |
DVI, SDTV, HDTV,
Mini-PCI |
|
TBM-16SDVOB |
Intel SDVO* |
Video Extension |
DVI, SDTV, HDTV,
Mini-PCI |
|
TBM-16SDVOD |
Intel SDVO* |
Video Extension |
Dual DVI, Mini-PCI |
|
TBM-15DVO |
Intel DVO** |
Video Extension |
DVI, SDTV,
Mini-PCI |
|
TBM-15DVP |
VIA DVP** |
Video Extension |
DVI, SDTV, LVDS,
Video Capture,
Mini-PCI |
|
TBM-15VB301 |
SiS VB** |
Video Extension |
DVI, SDTV,
Mini-PCI |
|
TBM-15VB302 |
SiS VB** |
Video Extension |
LVDS, Mini-PCI |
* Intel
SDVO is under x16 PCI Express bus interface.
** Intel
DVO, VIA DVP, SiS VB (Video Bridge) is under AGP bus
interface.
|
PCI Express Extension Solution
The Tiny-BusŪ PCI Express extension solution is integrated with
x16 PCI Express Graphics and 4-lane PCI Express supports one x4 PCI
Express or four x1 PCI Express bus interfaces based on Intel
embedded 915GME, 945GME, GME965 and later Express platform. <detail>
|
Table 4-2.
Tiny-Bus PCI
Express based Extension Module |
|
Tiny-Bus
Module |
Bus Interface |
Application |
Features |
|
TBM-16AM56 |
x16 PCI Express |
Graphics |
ATi M56 GPU |
|
TBM-1610 |
x16 PCI Express |
Graphics |
NVIDIA MXM
Type-I/II |
|
TBM-16SDVOA |
Intel SDVO* |
Video Extension |
DVI, SDTV, HDTV,
Mini-PCI |
|
TBM-16SDVOB |
Intel SDVO* |
Video Extension |
DVI, SDTV, HDTV,
Mini-PCI |
|
TBM-16SDVOD |
Intel SDVO* |
Video Extension |
Dual DVI, Mini-PCI |
|
TBM-1410 |
x1 PCI Express |
ExpressCard |
PCMCIA
ExpressCard, Mini-PCI |
|
TBM-1420 |
x1 PCI Express |
Video Capture |
120 fps Video
Capture |
* Intel
SDVO is under x16 PCI Express bus interface.
|
PCI Extension Solution
The Tiny-BusŪ PCI-based extension solution is integrated with
dual bus master 32-bit / 33MHz PCI bus interfaces and offers the
embedded Tiny-Bus expansibility with two bus master PCI based
peripheral or more PCI-based peripheral with arbiter or PCI bridge.
<detail>
|
Table 4-3.
Tiny-Bus
PCI-based Extension Module |
|
Tiny-Bus
Module |
Application |
Features |
|
TBM-1200 |
Multiple
Mini-PCI |
Dual Type-IIIA/B Mini-PCI |
|
TBM-1210 |
PCMCIA CardBus |
Dual PCMCIA
CardBus, Mini-PCI |
|
TBM-1220 |
Video Capture |
1-4 Channel / 30
fps Video Capture, Mini-PCI |
|
TBM-1222 |
Video Capture |
4 Channel / 120
fps Video Capture, Mini-PCI |
|
TBM-1230 |
Networking
Switch |
4 Port Fast
Ethernet Switch Hub, Mini-PCI |
|
TBM-1240 |
Multiple
Ethernet |
4 Port Gbit /
Fast Ethernet, Mini-PCI |
|
TBM-1250 |
Multiple Serial
Port |
4 COM / 1 LPT or
8 COM, Mini-PCI |
|
DC/ATX Power Converter Module
The TBM-DCX series Tiny-BusŪ DC/DC ATX power converter modules
are based on the Tiny-Bus form factor, and offer the DC-to-DC ATX
power output including 3.3V, 5V, 12V, -12V and 5Vsb with up to 150
watt of power capacity. With the features of Tiny-Bus configuration,
the TBM-DCX series provides the benefit of single power operating
for ATX-power required systems within the same dimension of
motherboard. <detail>
|
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Trademark and Patent |
|
The word of "Tiny-Bus" and the image of " "
are the registered trademark and the Tiny-Bus Modular Expansion
Solution is the registered patent of Liantec.
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